New One Part UV and Heat Curable Epoxy System Introduced
Bond Inc. of Hackensack, N.J., has announced the development of a special
dual cure (UV/heat curable) epoxy system called UV15DC80. It is designed
for bonding, sealing, coating and potting applications. This compound
has a low viscosity, is easy to apply and requires no mixing. Environmentally
friendly, it is 100% solid and contains no solvents or volatiles. UV15DC80
is not inhibited by oxygen and has low shrinkage upon cure.
Particularly noteworthy is that UV15DC80 can cure in shadowed areas by
supplemental heat curing at 80°C for 15-30 minutes. Straight UV curing
can be accomplished for thicknesses of .010"/.020" in seconds
using UV light at 365 nm with 30-40 milliwatts per cm² of energy.
Faster cures can be achieved at higher energy outputs. Post curing at
125-135°C for 15-30 minutes can increase the Tg from 90°C achieved
by straight UV cure to over 130°C.
UV15DC80 has high physical strength properties. Adhesion to metals, glass,
ceramics and most plastics is excellent. It has superior chemical resistance.
Shore D hardness is >70 and its elongation after cure is 3-4%. UV15DC80
has a tensile strength of >4,200 psi and a tensile modulus of 120,000
psi. Its refractive index is 1.517.
Storage stability of UV15DC80 is 6 months at room temperature in the original
unopened containers. It is available for use in half-pint, pint, quart,
gallon, and 5 gallon pail containers. For ease of use, it also is available
in syringe applicators.